IBM Research unveils hybrid bonding for packaging chipsNewsMike Murphy31 May 2023ChipletsSemiconductors
IBM’s CodeFlare significantly cuts the time to automate transfer learning tasks for foundation models ResearchBishwaranjan Bhattacharjee, Raghu Ganti, Carlos Costa, Mudhakar Srivatsa, and Nick Fuller16 Dec 20214 minute readData ManagementFoundation ModelsHybrid Cloud PlatformMachine Learning