Co-packaged optics deliver high-speed connectivity to supercharge generative AI computing
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Rapidus and IBM move closer to scaling out 2 nm chip production
NewsPeter HessCo-packaged optics deliver high-speed connectivity to supercharge generative AI computing
NewsPeter HessAn IBM-led team is exploring how AI can prepare the electrical grid for the low-carbon era
NewsPeter HessAccelerating discoveries with new AI tools, powerful chips — and turkey
ExplainerMike Murphy, Peter Hess, and Kim MartineauA new tool for accelerating the discovery of new materials
ResearchPeter HessFrom surf to satellites: Campbell Watson is bringing AI to Earth science
Deep DivePeter HessBuilding the future of chips in the USA
NewsMike Murphy and Peter HessBuilding agents, brain-like chips, and tiny semiconductors
NewsMike Murphy and Peter HessThe chips of tomorrow may well take inspiration from the architecture of our brains
ExplainerPeter HessNew algorithms open possibilities for training AI models on analog chips
ResearchPeter HessFor LLMs, IBM’s NorthPole chip overcomes the tradeoff between speed and efficiency
ResearchPeter HessHow memory augmentation can improve large language model efficiency and flexibility
ResearchPeter HessTraining AI models faster than ever
NewsPeter HessTeaching AI models to improve themselves
ResearchPeter HessDetecting health and science misinformation with AI
ResearchPeter HessIBM and RPI researchers demystify in-context learning in large language models
NewsPeter Hess
