Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm2
- Adam Pyzyna
- Hsinyu Tsai
- et al.
- 2017
- IITC 2017
Conference paper
Publications
13 results at IITC 2017
Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines
- Takeshi Nogami
- Raghuveer Patlolla
- et al.
- 2017
- IITC 2017
Conference paperPlanarity considerations in SADP for advanced BEOL patterning
- James H.-C. Chen
- Terry A. Spooner
- et al.
- 2017
- IITC 2017
Conference paperMethods to lower the resistivity of ruthenium interconnects at 7 nm node and beyond
- Xunyuan Zhang
- Huai Huang
- et al.
- 2017
- IITC 2017
Conference paperResistance contributions to copper interconnects
- C. Witt
- F. Baumann
- et al.
- 2017
- IITC 2017
Conference paperMicrostructure modulation for resistance reduction in copper interconnects
- Chih-Chao Yang
- Terry A. Spooner
- et al.
- 2017
- IITC 2017
Conference paperLayout based Monte-Carlo simulation (LBMCS) for complex back end of line (BEOL) design rule study
- Dongbing Shao
- Lawrence Clevenger
- et al.
- 2017
- IITC 2017
Conference paperImpact of pattern collapse on future micro/nano fabrication
- Xiao Hu Liu
- 2017
- IITC 2017
Conference paperMiddle of line RC performance study at the 7 nm node
- Susan Su Chen Fan
- James H.-C. Chen
- et al.
- 2017
- IITC 2017
Conference paperSegment removal strategy in SAQP for advanced BEOL application
- James H.-C. Chen
- Terry A. Spooner
- et al.
- 2017
- IITC 2017
Conference paper