Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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9 results at IITC 2018

Strategy of Insertion of Merge Features in a Sea of Wires SADP Integration
- - James H.-C. Chen
  - Terry A. Spooner
  - et al.
- 2018
- IITC 2018
Ru Liner Scaling with ALD TaN Barrier Process for Low Resistance 7 nm Cu Interconnects and beyond
- - Koichi Motoyama
  - O. Van Der Straten
  - et al.
- 2018
- IITC 2018
Impact of Line and Via Resistance on Device Performance at the 5nm Gate All Around Node and beyond
- - Nicholas A. Lanzillo
  - Koichi Motoyama
  - et al.
- 2018
- IITC 2018
Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
- - P. Bhosale
  - J. Maniscalco
  - et al.
- 2018
- IITC 2018
Validity and Application of the TCR Method to MOL contactS
- - E. Milosevic
  - Vimal Kamineni
  - et al.
- 2018
- IITC 2018
A Study on SADP Process Refresh for Patterning Correction
- - James H.-C. Chen
  - Isabel C Estrada-Raygoza
  - et al.
- 2018
- IITC 2018
Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects
- - Benjamin Uhlig
  - Abitha Dhavamani
  - et al.
- 2018
- IITC 2018
Impact of Liner Metals on Copper Resistivity at beyond 7nm Dimensions
- - H. Huang
  - Nicholas A. Lanzillo
  - et al.
- 2018
- IITC 2018
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- - Benjamin D. Briggs
  - C.B. Pcethala
  - et al.
- 2018
- IITC 2018