Strategy of Insertion of Merge Features in a Sea of Wires SADP Integration
- James H.-C. Chen
- Terry A. Spooner
- et al.
- 2018
- IITC 2018
Publications
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9 results at IITC 2018
Ru Liner Scaling with ALD TaN Barrier Process for Low Resistance 7 nm Cu Interconnects and beyond
- Koichi Motoyama
- O. Van Der Straten
- et al.
- 2018
- IITC 2018
Impact of Line and Via Resistance on Device Performance at the 5nm Gate All Around Node and beyond
- Nicholas A. Lanzillo
- Koichi Motoyama
- et al.
- 2018
- IITC 2018
Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
- P. Bhosale
- J. Maniscalco
- et al.
- 2018
- IITC 2018
Validity and Application of the TCR Method to MOL contactS
- E. Milosevic
- Vimal Kamineni
- et al.
- 2018
- IITC 2018
A Study on SADP Process Refresh for Patterning Correction
- James H.-C. Chen
- Isabel C Estrada-Raygoza
- et al.
- 2018
- IITC 2018
Challenges and Progress on Carbon Nanotube Integration for BEOL Interconnects
- Benjamin Uhlig
- Abitha Dhavamani
- et al.
- 2018
- IITC 2018
Impact of Liner Metals on Copper Resistivity at beyond 7nm Dimensions
- H. Huang
- Nicholas A. Lanzillo
- et al.
- 2018
- IITC 2018
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018