Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- Atom O. Watanabe
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Publications
802 results for Semiconductors
A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Duixian Liu
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
On the path to AI hardware via chiplet integration enabled by high density organic substrates
- Griselda Bonilla
- Brian Quinlan
- et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- Juliano Borges
- Maxime Darnon
- et al.
- 2023
- ECTC 2023
Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- Katsuyuki Sakuma
- Griselda Bonilla
- et al.
- 2023
- ECTC 2023
A new era of collaborative experimentation enabled by multi-cloud and AI foundation models
- Patrick Ruch
- Alain Vaucher
- et al.
- 2023
- Future Labs Live 2023
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- Griselda Bonilla
- 2023
- iTHERM 2023
SUSTAINABLE COMPUTING – THERMAL CHALLENGES AND OPPORTUNITIES
- 2023
- iTHERM 2023