Publications

Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- - Jae-Woong Nah
  - Michael A. Gaynes
  - et al.
- 2011
- ECTC 2011
Electromagnetic-SPICE modeling and analysis of 3D power network
- - Zheng Xu
  - Jian-Qiang Lu
  - et al.
- 2011
- ECTC 2011
Code coverage analysis in practice for large systems
- - Yoram Adler
  - Noam Behar
  - et al.
- 2011
- ICSE 2011
A framework for automated testing of JavaScript web applications
- - Shay Artzi
  - Julian Dolby
  - et al.
- 2011
- ICSE 2011
Deploying CogTool: Integrating quantitative usability assessment into real-world software development
- - Rachel Bellamy
  - Bonnie John
  - et al.
- 2011
- ICSE 2011
Blending freeform and managed information in tables (NIER track)
- - Nicolas Mangano
  - Harold Ossher
  - et al.
- 2011
- ICSE 2011
Sketching tools for ideation (NIER track)
- - Rachel Bellamy
  - Michael Desmond
  - et al.
- 2011
- ICSE 2011
Angelic debugging
- - Satish Chandra
  - Emina Torlak
  - et al.
- 2011
- ICSE 2011
Workshop on flexible modeling tools (FlexiTools 2011)
- - Harold Ossher
  - André Van Der Hoek
  - et al.
- 2011
- ICSE 2011
Refactoring Java programs for flexible locking
- - Max Schäfer
  - Manu Sridharan
  - et al.
- 2011
- ICSE 2011