On implementing a text-database-as-a-service
- Yaoliang Chen
- Chang Liu
- et al.
- 2016
- ICWS 2016
Publications
Date
Featured collections
Popular topics
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- Keiji Matsumoto
- Hiroyuki Mori
- 2016
- ECTC 2016
Solder Injected through Via for Multi Stacked Wafers
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2016
- ECTC 2016
Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2016
- ECTC 2016
Feasibility Study of Si Handler Debonding by Laser Release
- Bing Dang
- Thomas Wassick
- et al.
- 2016
- ECTC 2016
Scalable Optical Coupling between Silicon Photonics Waveguides and Polymer Waveguides
- Antonio La Porta
- Roger Dangel
- et al.
- 2016
- ECTC 2016
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
- Yves Martin
- Jae Woong Nah
- et al.
- 2016
- ECTC 2016
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016