All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016
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Scalable Optical Coupling between Silicon Photonics Waveguides and Polymer Waveguides
- Antonio La Porta
- Roger Dangel
- et al.
- 2016
- ECTC 2016
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
BotMeter: Charting DGA-Botnet Landscapes in Large Networks
- Ting Wang
- Xin Hu
- et al.
- 2016
- ICDCS 2016
Cognitive Technologies for Smarter Cities
- Martin G. Kienzle
- 2016
- ICDCS 2016
An Endpoint Communication Profiling Tool for Distributed Computing Frameworks
- Andrea Rosá
- Lydia Y. Chen
- et al.
- 2016
- ICDCS 2016
Dslash: Managing Data in Overloaded Batch Streaming Systems
- Robert Birke
- Mathias Bjorkqvist
- et al.
- 2016
- ICDCS 2016
Service Placement for Detecting and Localizing Failures Using End-to-End Observations
- Ting He
- Novella Bartolini
- et al.
- 2016
- ICDCS 2016
On the Efficiency of Decentralized Search in Expert Networks
- Liang Ma
- Mudhakar Srivatsa
- et al.
- 2016
- ICDCS 2016