3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- ECTC 2021
Publications
59 results for Katsuyuki Sakuma
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- Katsuyuki Sakuma
- Mukta Farooq
- et al.
- 2021
- IEEE Transactions on CPMT
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing
- Gaddi Blumrosen
- Katsuyuki Sakuma
- et al.
- 2020
- IEEE Access
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2019
- IEEE Sensors Journal
Turning the Finger into a Writing Tool
- Katsuyuki Sakuma
- Gaddi Blumrosen
- et al.
- 2019
- EMBC 2019
A wearable fingernail deformation sensing system and three-dimensional finite element model of fingertip
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2019
- ECTC 2019
Wearable Nail Deformation Sensing for Behavioral and Biomechanical Monitoring and Human-Computer Interaction
- Katsuyuki Sakuma
- Avner Abrami
- et al.
- 2018
- Scientific Reports
Flexible Piezoresistive Sensors Fabricated by Spalling Technique
- Katsuyuki Sakuma
- Huan Hu
- et al.
- 2018
- IFETC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- Pascale Gagnon
- Christian Bergeron
- et al.
- 2017
- ECTC 2017