Publications

59 results for Katsuyuki Sakuma

Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- - Katsuyuki Sakuma
  - Dishit Parekh
  - et al.
- 2021
- ECTC 2021
3-D Die Stacking with 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
- - Katsuyuki Sakuma
  - Mukta Farooq
  - et al.
- 2021
- IEEE Transactions on CPMT
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing
- - Gaddi Blumrosen
  - Katsuyuki Sakuma
  - et al.
- 2020
- IEEE Access
CMOS-Compatible Wearable Sensors Fabricated Using Controlled Spalling
- - Katsuyuki Sakuma
  - Huan Hu
  - et al.
- 2019
- IEEE Sensors Journal
Turning the Finger into a Writing Tool
- - Katsuyuki Sakuma
  - Gaddi Blumrosen
  - et al.
- 2019
- EMBC 2019
A wearable fingernail deformation sensing system and three-dimensional finite element model of fingertip
- - Katsuyuki Sakuma
  - Bucknell Webb
  - et al.
- 2019
- ECTC 2019
Wearable Nail Deformation Sensing for Behavioral and Biomechanical Monitoring and Human-Computer Interaction
- - Katsuyuki Sakuma
  - Avner Abrami
  - et al.
- 2018
- Scientific Reports
Flexible Piezoresistive Sensors Fabricated by Spalling Technique
- - Katsuyuki Sakuma
  - Huan Hu
  - et al.
- 2018
- IFETC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- - John Knickerbocker
  - Russell A. Budd
  - et al.
- 2018
- ECTC 2018
Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- - Pascale Gagnon
  - Christian Bergeron
  - et al.
- 2017
- ECTC 2017