Hot water cooled electronics for high exergetic utility
- Severin Zimmermann
- Manish K. Tiwari
- et al.
- 2012
- ASME HT 2012
Publications
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20 results for Severin Zimmermann
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
- Jonas Zürcher
- Xi Chen
- et al.
- 2015
- NANO 2015
Self-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
- Christian Hofmann
- Mario Baum
- et al.
- 2015
- SSI 2015
Characterization of particle beds in percolating thermal underfills based on centrifugation
- Severin Zimmermann
- Thomas Brunschwiler
- et al.
- 2014
- 3DIC 2014
Thermo-mechanical properties of underfills at partial and full filler percolation - Sub-layering the underfill
- Gerd Schlottig
- Marie Haupt
- et al.
- 2014
- EuroSimE 2014
Advanced liquid cooling in HCPVT systems to achieve higher energy efficiencies
- S. Zimmermann
- H. Helmers
- et al.
- 2013
- CPV 2013
Thermal management and overall performance of a high concentration PV
- Werner Escher
- Stephan Paredes
- et al.
- 2012
- CPV 2012
Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
- Manish K. Tiwari
- Severin Zimmermann
- et al.
- 2012
- ITherm 2012
Cooling of next generation computer chips: Parametric study for single- and two-phase cooling
- Yassir Madhour
- Severin Zimmermann
- et al.
- 2011
- THERMINIC 2011