Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- Chris Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Publications
This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Featured collections
Popular topics
Year
18 results for Dominik Metzler
First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications
- Heng Wu
- Veenadhar Katragadda
- et al.
- 2021
- IEDM 2021
Simulation of photoresist defect transfer through subsequent patterning processes
- Dominik Metzler
- Mohamed Oulmane
- et al.
- 2020
- SPIE Advanced Lithography 2020
Polymer brush as adhesion promoter for EUV patterning
- Jing Guo
- Anuja De Silva
- et al.
- 2018
- SPIE Advanced Lithography 2018
Introduction of pre-etch deposition techniques in EUV patterning
- Xun Xiang
- Genevieve Beique
- et al.
- 2018
- SPIE Advanced Lithography 2018
Control of Plasma Etch Conditions through Pulsed, Cyclic, and QALE Processes for Advanced Node Applications
- 2023
- PESM 2023
Etch and Patterning Development for 2nm Node Nanosheet Devices
- Eric Miller
- Indira Seshadri
- et al.
- 2022
- SPIE Advanced Lithography 2022
Exploration of pillar local CDU improvement options for AI applications
- Charlie Liu
- Hao Tang
- et al.
- 2020
- SPIE Advanced Lithography 2020
An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
- R. S. Smith
- E. T. Ryan
- et al.
- 2019
- AIP Advances
Characterizing fluorocarbon assisted atomic layer etching of Si using cyclic Ar/C4F8 and Ar/CHF3 plasma
- Dominik Metzler
- Chen Li
- et al.
- 2016
- Journal of Chemical Physics