Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- C. J. Penny
- Koichi Motoyama
- et al.
- 2022
- IEDM 2022
Publications
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25 results for Dominik Metzler
First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications
- H. Wu
- V. Katragadda
- et al.
- 2021
- IEDM 2021
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Predicting and Measuring Scummed Contact Holes
- Elisa Novelli
- Chris A. Mack
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
A novel single damascene process for via metal corrosion-free interconnects in advanced nodes
- Koichi Motoyama
- Dominik Metzler
- et al.
- 2024
- IITC 2024
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Simulation of photoresist defect transfer through subsequent patterning processes
- Dominik Metzler
- Mohamed Oulmane
- et al.
- 2020
- SPIE Advanced Lithography 2020
Polymer brush as adhesion promoter for EUV patterning
- Jing Guo
- Anuja De Silva
- et al.
- 2018
- SPIE Advanced Lithography 2018
Introduction of pre-etch deposition techniques in EUV patterning
- Xun Xiang
- Genevieve Beique
- et al.
- 2018
- SPIE Advanced Lithography 2018
Control of Plasma Etch Conditions through Pulsed, Cyclic, and QALE Processes for Advanced Node Applications
- 2023
- PESM 2023