Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling
- 2022
- IEDM 2022
Publications
This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
17 results for Dominik Metzler
First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications
- 2021
- IEDM 2021
Simulation of photoresist defect transfer through subsequent patterning processes
- 2020
- SPIE Advanced Lithography 2020
Polymer brush as adhesion promoter for EUV patterning
- 2018
- SPIE Advanced Lithography 2018
Introduction of pre-etch deposition techniques in EUV patterning
- 2018
- SPIE Advanced Lithography 2018
Etch and Patterning Development for 2nm Node Nanosheet Devices
- 2022
- SPIE Advanced Lithography 2022
Exploration of pillar local CDU improvement options for AI applications
- 2020
- SPIE Advanced Lithography 2020
An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
- 2019
- AIP Advances
Characterizing fluorocarbon assisted atomic layer etching of Si using cyclic Ar/C4F8 and Ar/CHF3 plasma
- 2016
- Journal of Chemical Physics
He plasma pretreatment of organic masking materials for performance improvement during pattern transfer by plasma etching
- 2016
- JVSTB