Additive Lithography - Organic Monolayer Patterning Coupled with an Area-Selective Deposition
- Rudy Wojtecki
- Jonathan Ma
- et al.
- 2021
- ACS AMI
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62 results for Nick Lanzillo
Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
- Andrew Simon
- O. Van Der Straten
- et al.
- 2020
- JVSTA
First-Principles Evaluation of fcc Ruthenium for its use in Advanced Interconnects
- Timothy M. Philip
- Nicholas A. Lanzillo
- et al.
- 2020
- Physical Review Applied
Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects
- Nicholas A. Lanzillo
- Lawrence Clevenger
- et al.
- 2020
- Journal of Applied Physics
Spin-dependent electron scattering in cobalt interconnects
- Nicholas A. Lanzillo
- P. Bhosale
- et al.
- 2019
- Journal of Physics D: Applied Physics
Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects
- Nicholas A. Lanzillo
- Benjamin D. Briggs
- et al.
- 2019
- Computational Materials Science
Defect and grain boundary scattering in tungsten: A combined theoretical and experimental study
- Nicholas A. Lanzillo
- H. Dixit
- et al.
- 2018
- Journal of Applied Physics
Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
- Nicholas A. Lanzillo
- Oscar D. Restrepo
- et al.
- 2018
- Applied Physics Letters
First-Principles Investigations of TiGe/Ge Interface and Recipes to Reduce the Contact Resistance
- H. Dixit
- Chengyu Niu
- et al.
- 2017
- IEEE T-ED
Electronic and structural analysis of ultra-small-diameter metal disilicide nanowires
- Nicholas A. Lanzillo
- T. Standaert
- et al.
- 2017
- Journal of Applied Physics