Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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15 results for Sayuri Kohara

Effects of build-up material properties on warpage dispersion of organic substrates caused by manufacturing variations
- - Keishi Okamoto
  - Sayuri Kohara
  - et al.
- 2017
- InterPACK 2017
Advanced interconnect technologies in the era of cognitive computing
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2016
- Pan Pacific 2016
Warpage analysis of organic substrates for 2.1D packaging
- - Sayuri Kohara
  - Keishi Okamoto
  - et al.
- 2015
- 3DIC 2015
Effects of low CTE materials on thermal deformation of organic substrates in flip chip package application
- - Hiroyuki Mori
  - Sayuri Kohara
  - et al.
- 2015
- InterPACK 2015
Warpage modeling technique of organic interposer considering deformation by insulator material shrinkage
- - Keishi Okamoto
  - Sayuri Kohara
  - et al.
- 2015
- ICEP-IAAC 2015