Electrical integrity of state-of-the-art 0.13 μm SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
- K.W. Guarini
- A. Topol
- et al.
- 2002
- IEDM 2002
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3 results for H.B. Pogge
Wafer-scale microdevice transfer/interconnect: From a new integration method to its application in an afm-based data-storage system
- M. Despont
- U. Drechsler
- et al.
- 2003
- TRANSDUCERS 2003
Wafer-scale microdevice transfer/interconnect: Its application in an AFM-based data-storage system
- Michel Despont
- Ute Drechsler
- et al.
- 2004
- JMEMS