An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
- R. S. Smith
- E. T. Ryan
- et al.
- 2019
- AIP Advances
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24 results for Koichi Motoyama
Application of Cu Reflow Process on Ru Liner for Advanced Nanoscale Interconnects
- K. Motoyama
- O. van der Straten
- 2024
- ECS J. Solid State Sci. Technol.
CMP development for Ru liner structures beyond 14nm
- Raghuveer Patlolla
- Koichi Motoyama
- et al.
- 2018
- ECS J. Solid State Sci. Technol.
PVD Cu reflow seed process optimization for defect reduction in nanoscale Cu/Low-k dual damascene interconnects
- K. Motoyama
- O. Van Der Straten
- et al.
- 2013
- JES