T.N. Huynh, Anand Ramaswamy, et al.
Journal of Lightwave Technology
We report on the design, fabrication, packaging and characterization of a 4-channel semiconductor optical amplifier (SOA) flip-chip mounted on a photonic carrier. Significant loss occurs across high radix silicon photonic switching platforms due to multiple switching stages, waveguide crossings and I/O coupling elements. To overcome these losses, we propose the hybrid integration of a III-V SOA onto a photonic switch carrier to realize a gain neutral switch. Custom four channel cleaved facet SOA variants were designed with unique mounting structures for precise vertical alignment. A photonic carrier test site was designed with unique SiN waveguide coupling structures, vertical reference stops, a trench with metal lines and AuSn solder bumps for device bonding. Individual SOAs were attached to photonic carriers using a precision flip-chip bonder. All assemblies exhibited good bond strength and no line-line shorts were observed. The SOA and assembled test sites were characterized in the 1.5- 1.6 μm wavelength range. A net SOA/photonic carrier optical gain of greater than 10 dB was observed.
T.N. Huynh, Anand Ramaswamy, et al.
Journal of Lightwave Technology
Xiaogang Chen, Benjamin G. Lee, et al.
CLEO 2007
Benjamin G. Lee, Solomon Assefa, et al.
CLEO-SI 2011
Benjamin G. Lee, Seongwon Kim, et al.
CLEO 2014