Reduced Radius Removal and its Effect on In-line and Field Reliability Improvements

Abstract

While circuit techniques and process technology permit the fabrication of high-performance and high density chips, reliability must keep pace with the ever-increasing circuit density and system complexity. The development of insitu burn-in-tests performed during burn-in to ensure that the chips are experiencing proper stress and to identify failures which may potentially be corrected - has decreased the post burn-in failure rate by a factor of 30 or more. The proper stresses, tests, and measurements at wafer and chip level have enabled us to produce "known good die" which can be mounted on multichip packages. A combination of in-line, end-of-line, system, and field data on over one million chips demonstrate our reliability improvements.