Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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5 results for C. J. Penny

Interconnect scaling challenges, and opportunities to enable system-level performance beyond 30 nm pitch
- - Griselda Bonilla
  - N. Lanzillo
  - et al.
- 2020
- IEDM 2020
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
- - T. Nogami
  - H. Huang
  - et al.
- 2019
- VLSI Technology 2019
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
- - T. Nogami
  - Benjamin D. Briggs
  - et al.
- 2015
- IEDM 2015
Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- - N. Lanzillo
  - Kisik Choi
  - et al.
- 2019
- IEEE Electron Device Letters
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- - C. J. Penny
  - S. Gates
  - et al.
- 2017
- IITC 2017