225 Gb/s bi-directional integrated optical PCB link
Clint L. Schow, Fuad Doany, et al.
OFC 2011
The stringent on-and off-chip communications demands of future-generation chip multiprocessors require innovative and potentially disruptive technology solutions, such as chip-scale photonic transmission systems. A space-switched, wavelength-parallel photonic network-on-chip has been shown to equip users with high-bandwidth, low-latency links in an energy-efficient manner. Here, experimental measurements on fabricated silicon photonic devices verify a large set of the components needed to construct these networks. The proposed system architecture is reviewed to motivate the demanding performance requirements of the components. Then, systems-level investigations are delineated for multiwavelength electrooptic modulators and photonic switching elements arranged in 1 × 2, 2 × 2, and 4 × 4 formations. Compact ( ∼10 μm), high-speed (4 Gb/s) modulators, having a large degree of channel scalability (four channels demonstrated), are demonstrated with excellent data integrity (bit error (BERs)10-12). Meanwhile, switches are shown to transfer extensive throughput bandwidths (250 Gb/s) with fast switching speeds (1 ns) and sufficient extinction ratios (≥10 dB). Data integrity is also verified for the switches (BERs ≤10-12) with power penalty measurements amid dynamic operation. These network component demonstrations verify the feasibility of the proposed system architecture, while previous works have verified its efficacy. © 2006 IEEE.
Clint L. Schow, Fuad Doany, et al.
OFC 2011
Alexander V. Rylyakov, Jonathan E. Proesel, et al.
ISSCC 2015
A. Mahendra, Douglas M. Gill, et al.
CLEO 2017
Benjamin G. Lee, Xiaogang Chen, et al.
LEOS 2007