William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
It is possible under favorable circumstances to identify composition, bonding, and electronic structure with atomic resolution in microelectronic device structures. In current device structures, where only a few interface atoms can dominate the performance of a device, this can contribute important understanding relevant to product development. This paper is a brief overview of work in our laboratory using scanning transmission electron microscopy to achieve such capabilities.
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
John M. Boyer, Charles F. Wiecha
DocEng 2009
Zohar Feldman, Avishai Mandelbaum
WSC 2010
N.K. Ratha, A.K. Jain, et al.
Workshop CAMP 2000