Publication
MCMC 1994
Conference paper

Applications of latent open test

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Abstract

As metal interconnections in multichip modules (MCM) are getting narrower and thinner, latent open defects such as notches, nicks, weak connections, etc., will have a greater chance to occur under normal manufacturing processes. We have applied a phase-sensitive nonlinearity detection technique to detect such latent open defects in MCM-D and MCM-C substrates. Use of this technique for qualifying opens repair techniques and wire bonding process control is reported.

Date

Publication

MCMC 1994

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