Application of RF Discharges to sputtering

Abstract

The operation of rf discharges is described and the internal distribution of voltages is considered. The significance of this with respect to sputtering, particularly of insulators, is then discussed. An equivalent circuit for the discharge is presented and the influence of such parameters as pressure and magnetic field on the components of this circuit is described. Finally, energy distributions for positive ions, electrons, and negative ions incident at the substrate during deposition are given. © 2000 IBM.