David F. Heidel, Kenneth P. Rodbell, et al.
IEEE TNS
The emitted alpha particle energy distribution from solder bumps can show substantial surface emission which has a large impact on the modeled SEU rate. State-of-the art alpha-particle detectors are required to measure the low emissivity and energy distribution. © 2010 IEEE.
David F. Heidel, Kenneth P. Rodbell, et al.
IEEE TNS
Michael S. Gordon, Ken Rodbell, et al.
IEEE TNS
Paul Solomon, Brian A. Bryce, et al.
Nano Letters
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IBM J. Res. Dev