Henry H. K. Tang, Conal E. Murray, et al.
IEEE TNS
Paper
Alpha-particle emission energy spectra from materials used for solder bumps
Abstract
The emitted alpha particle energy distribution from solder bumps can show substantial surface emission which has a large impact on the modeled SEU rate. State-of-the art alpha-particle detectors are required to measure the low emissivity and energy distribution. © 2010 IEEE.
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