24×24 Pixel focal plane array for THz imaging applications

Abstract

A focal plane array of 24×24 elements for imaging applications in the 0.6-1.2 THz range was fabricated in a SOI-CMOS process and post-processed with MEMS technology. The pixels are fully released antenna-coupled CMOS microbolometers, where the sensing element is a lateral diode. The chip includes a column-multiplexed readout circuit with digital calibration and analog output. The pixel responsivity and NEP were characterized with CW sources, showing high sensitivity.