Toward perfect on-wafer pattern placement: Stitched overlay exposure tool characterization
- Christopher P. Ausschnitt
- Timothy A. Brunner
- et al.
- 2010
- SPIE Advanced Lithography 2010
Publications
Predicting and reducing substrate induced focus error
- Bernhard Liegl
- Brian Sapp
- et al.
- 2010
- SPIE Advanced Lithography 2010
Overlay characterization and matching of immersion photoclusters
- Blandine Minghetti
- Timothy Brunner
- et al.
- 2010
- SPIE Advanced Lithography 2010
Simultaneous measurement of optical properties and geometry of resist using multiple scatterometry targets
- Alok Vaid
- Matthew Sendelbach
- et al.
- 2010
- Journal of Micro/Nanolithography, MEMS, and MOEMS
Predicting substrate-induced focus error
- Bernhard Liegl
- Brian Sapp
- et al.
- 2010
- Journal of Micro/Nanolithography, MEMS, and MOEMS
Patents
Blog posts
IBM and Albany partners unlock new yield benchmarks for EUV patterning
Technical noteLuciana Meli and Nelson FelixEUV patterning yield breakthrough sets new benchmark for logic scaling
Technical noteNelson Felix and Luciana Meli4 minute readIBM Research at SPIE 2020: New architectures and fabrications for AI hardware
ResearchNelson Felix4 minute read
Top collaborators
LM
Luciana Meli
Senior Manager: Patterning & Metrology
NL
Nicolas Loubet
STSM, Advanced Logic Technology Research
MB
Mary Breton
Technical Assistant to Huiming Bu | Semiconductor Enablement Program Management & Infrastructure
HB
Huiming Bu
Vice President: IBM Semiconductors Global R&D and Albany Operations