Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Conference paper
60-micrometer pitch polymer waveguide array attached active optical flex
Abstract
We present a 60-micrometer pitch polymer waveguide array attached active optical flexible module which is useful for compact and high-channel count optical interconnect. We fabricated this module and realized 20-Gbps optical signal transmission.
Related
Tymon Barwicz, Yoichi Taira, et al.
GFP 2015
Conference paper
Optical package design for silicon photonic chips
Yoichi Taira, Hidetoshi Numata
LS 2010
Jean Benoit Héroux, Tomofumi Kise, et al.
Journal of Lightwave Technology