A Reconfigurable Accelerator with Data Reordering Support for Low-Cost On-Chip Dataflow Switching
- Jianming Tong
- Anirudh Itagi
- et al.
- 2024
- ISCA 2024
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HAL: Hardware-assisted Load Balancing for Energy-efficient SNIC-Host Cooperative Computing
- Jinghan Huang
- Jiaqi Lou
- et al.
- 2024
- ISCA 2024
EcoFaaS: Rethinking the Design of Serverless Environments for Energy Efficiency
- Jovan Stojkovic
- Nikoleta Iliakopoulou
- et al.
- 2024
- ISCA 2024
First demonstration of high retention energy barriers and 2 ns switching, using magnetic ordered-alloy-based STT MRAM devices
- Matthias Gottwald
- Guohan Hu
- et al.
- 2024
- VLSI Technology and Circuits 2024
A 400-ns-Settling Time Hybrid Dynamic Voltage Frequency Scaling Architecture and Its Application in a 22-Core Network-on-Chip SoC in 12-nm FinFET Technology
- Erik Loscalzo
- Martin Cochet
- et al.
- 2024
- VLSI Technology and Circuits 2024
State-Independent Low Resistance Drift SiSbTe Phase Change Memory for Analog In-Memory Computing Applications
- Michelle Cheng
- Zhi-Lun Liu
- et al.
- 2024
- VLSI Technology and Circuits 2024
Backside power distribution for nanosheet technologies beyond 2nm
- Ruilong Xie
- Wonhyuk Hong
- et al.
- 2024
- VLSI Technology and Circuits 2024
A 0.88pJ/bit 112Gb/s PAM4 Transmitter with 1Vppd Output Swing and 5-Tap Analog FFE in 7nm FinFET CMOS
- Zeynep Toprak-Deniz
- Timothy O. Dickson
- et al.
- 2024
- VLSI Technology and Circuits 2024
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024