Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- - Katsuyuki Sakuma
  - Dishit Parekh
  - et al.
- 2021
- ECTC 2021
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate
- - Katsuyuki Sakuma
  - Mukta Farooq
  - et al.
- 2021
- ECTC 2021
Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- - Kamal Sikka
  - Ravi Bonam
  - et al.
- 2021
- ECTC 2021
Novel Phased Array Antenna-in-Package Development and Active Module Demonstration for 5G Millimeter-Wave Wireless Communication
- - Xiaoxiong Gu
  - Duixian Liu
  - et al.
- 2021
- ECTC 2021
Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
- - Keiji Matsumoto
  - Marc Bergendahl
  - et al.
- 2021
- ECTC 2021
Enabling Next Generation CMOS by Novel EOT Scaling Module
- - Lin Dong
  - Steven Hung
  - et al.
- 2021
- VLSI Technology 2021
HERMES Core - A 14nm CMOS and PCM-based In-Memory Compute Core using an array of 300ps/LSB Linearized CCO-based ADCs and local digital processing
- - Riduan Khaddam Aljameh
  - Milos Stanisavljevic
  - et al.
- 2021
- VLSI Technology 2021
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- - P. Bhosale
- 2021
- VLSI Technology 2021
Challenges and Opportunities for Stacked Transistor: DTCO and Device
- - Junli Wang
  - Sung Dae Suk
  - et al.
- 2021
- VLSI Technology 2021
NbN-Gated GaN Transistor Technology for Applications in Quantum Computing Systems
- - Qingyun Xie
  - Nadim Chowdhury
  - et al.
- 2021
- VLSI Technology 2021