Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
Publications
802 results for Semiconductors
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- Keiji Matsumoto
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- Mukta Farooq
- Arvind Kumar
- et al.
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- Sayuri Kohara
- Toyohiro Aoki
- et al.
- 2022
- ITherm 2022
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Electron Microscopy and EDS analysis of InGaAs-InP Heterointerfaces in Horizontal Nanowires Grown with the TASE Process
- Enrico Brugnolotto
- Markus Scherrer
- et al.
- 2022
- e-MRS Spring Meeting 2022
Scalable, Nanometer-Accurate Fabrication of All-Dielectric Metasurfaces with Narrow Resonances Tunable from Near Infrared to Visible Wavelengths
- Giulia Prone
- Ute Drechsler
- et al.
- 2022
- Advanced Photonics Research
Quantifying Composable Data Center Utilization
- Marc Taubenblatt
- Asser Tantawi
- 2022
- IPDPSW 2022