Multicore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2014
- ECTC 2014
Conference paper
Publications
Factors in the selection of temporary wafer handlers for 3D/2.5D integration
- Bing Dang
- Bucknell Webb
- et al.
- 2014
- ECTC 2014
Conference paperAdvanced wafer bonding and laser debonding
- Paul Andry
- Russell A. Budd
- et al.
- 2014
- ECTC 2014
Conference paperDevelopment of electroless nickel-iron plating process for microelectronic applications
- Yu Luo
- Sung K. Kang
- et al.
- 2014
- ECTC 2014
Conference paperAssembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014
Conference paperAssembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2014
- ECTC 2014
Conference paperTransferrable fine pitch probe technology
- Y. Liu
- S.L. Wright
- et al.
- 2014
- ECTC 2014
Conference paperPreparing 25Gbps electrical I/O for exascale computing systems
- Lei Shan
- Young Kwark
- et al.
- 2014
- ECTC 2014
Conference paperBonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Conference paperControlling the Sn grain morphology of SnAg C4 solder bumps
- Gregory Parks
- Minhua Lu
- et al.
- 2014
- ECTC 2014
Conference paper