Publications

All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- - Jonas Zürcher
  - Luca Del Carro
  - et al.
- 2016
- ECTC 2016
Conference paper
Scalable Optical Coupling between Silicon Photonics Waveguides and Polymer Waveguides
- - Antonio La Porta
  - Roger Dangel
  - et al.
- 2016
- ECTC 2016
Conference paper
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
- - Yves Martin
  - Jae Woong Nah
  - et al.
- 2016
- ECTC 2016
Conference paper
A Four-Channel Silicon Photonic Carrier with Flip-Chip Integrated Semiconductor Optical Amplifier (SOA) Array Providing >10-dB Gain
- - Fuad Doany
  - Russell A. Budd
  - et al.
- 2016
- ECTC 2016
Conference paper
Solder Injected through Via for Multi Stacked Wafers
- - Akihiro Horibe
  - Kuniaki Sueoka
  - et al.
- 2016
- ECTC 2016
Conference paper
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- - Bing Dang
  - Evan Colgan
  - et al.
- 2016
- ECTC 2016
Conference paper
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- - Keiji Matsumoto
  - Hiroyuki Mori
- 2016
- ECTC 2016
Conference paper
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- - Katsuyuki Sakuma
  - Bucknell Webb
  - et al.
- 2016
- ECTC 2016
Conference paper
BotMeter: Charting DGA-Botnet Landscapes in Large Networks
- - Ting Wang
  - Xin Hu
  - et al.
- 2016
- ICDCS 2016
Conference paper
On the Efficiency of Decentralized Search in Expert Networks
- - Liang Ma
  - Mudhakar Srivatsa
  - et al.
- 2016
- ICDCS 2016
Conference paper