In-line XPS metrology for area selective deposition processes on patterned structures
- Manasa Medikonda
- Linda Wangoh
- et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Publications
18 results for Aron Cepler
Metrology-Design Co-Optimization for BEOL dimensional characterization using scatterometry
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperScatterometry-informed machine learning study to determine bi-directional intercorrelation of adjacent patterning steps
- Padraig Timoney
- Stefan Schoeche
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paperSpectral Interferometry for TSV Metrology in Chiplet Technology
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paperSpectral interferometry for fully integrated device metrology
- Daniel Schmidt
- Manasa Medikonda
- et al.
- 2023
- JM3
PaperTSV Stress Evolution Mapping using in-line Raman Spectroscopy
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Conference paperVertical Travelling Scatterometry for Metrology on Fully Integrated Devices
- D. Schmidt
- Manasa Medikonda
- et al.
- 2022
- SPIE Advanced Lithography 2022
Conference paperScatterometry based methodologies for characterization of MRAM technology
- Manasa Medikonda
- Daniel Schmidt
- et al.
- 2022
- SPIE Advanced Lithography 2022
Conference paperDevelopment of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement
- Daniel Schmidt
- Aron Cepler
- et al.
- 2022
- IEEE Trans Semicond Manuf
PaperIn-line Raman spectroscopy for gate-all-around nanosheet device manufacturing
- Daniel Schmidt
- Curtis Durfee
- et al.
- 2022
- JM3
Paper