Spectral Interferometry for TSV Metrology in Chiplet Technology
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Publications
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17 results for Aron Cepler
TSV Stress Evolution Mapping using in-line Raman Spectroscopy
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Scatterometry-informed machine learning study to determine bi-directional intercorrelation of adjacent patterning steps
- Padraig Timoney
- Stefan Schoeche
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Metrology-Design Co-Optimization for BEOL dimensional characterization using scatterometry
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Vertical Travelling Scatterometry for Metrology on Fully Integrated Devices
- D. Schmidt
- Manasa Medikonda
- et al.
- 2022
- SPIE Advanced Lithography 2022
Scatterometry based methodologies for characterization of MRAM technology
- Manasa Medikonda
- Daniel Schmidt
- et al.
- 2022
- SPIE Advanced Lithography 2022
Advanced EUV Resist Characterization using Scatterometry and Machine Learning
- Daniel Schmidt
- Karen Petrillo
- et al.
- 2021
- ASMC 2021
OCD enhanced: Implementation and validation of spectral interferometry for nanosheet inner spacer indentation
- Daniel Schmidt
- C. Durfee
- et al.
- 2021
- SPIE Advanced Lithography 2021
In-line Raman spectroscopy for stacked nanosheet device manufacturing
- Daniel Schmidt
- C. Durfee
- et al.
- 2021
- SPIE Advanced Lithography 2021
Development of SiGe Indentation Process Control to Enable Stacked Nanosheet FET Technology
- Dexin Kong
- Daniel Schmidt
- et al.
- 2020
- ASMC 2020