Solder/adhesive bonding using simple planarization technique for 3D integration
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2011
- ECTC 2011
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9 results for Shuichi Shoji
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections
- K. Sakuma
- N. Nagai
- et al.
- 2009
- ECTC 2009
Low temperature Au-Au flip chip bonding with VUV/O 3 treatment for 3D integration
- Akiko Okada
- Masatsugu Nimura
- et al.
- 2012
- LTB-3D 2012
Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
- Naoko Unami
- Hirokazu Noma
- et al.
- 2011
- APM 2011
Hybrid au-adhesive bonding using planar adhesive structure for 3-D LSI
- Masatsugu Nimura
- Jun Mizuno
- et al.
- 2014
- IEEE Transactions on CPMT
Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- Katsuyuki Sakuma
- Jun Mizuno
- et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
Effects of excimer irradiation treatment on thermocompression Au-Au bonding
- Naoko Unami
- Katsuyuki Sakuma
- et al.
- 2010
- Japanese Journal of Applied Physics
Simplified 20-μm pitch vertical interconnection process for 3D chip stacking
- Katsuyuki Sakuma
- Noriyasu Nagai
- et al.
- 2009
- IEEJ Transactions on Electrical and Electronic Engineering