Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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9 results for Shuichi Shoji

Solder/adhesive bonding using simple planarization technique for 3D integration
- - Masatsugu Nimura
  - Jun Mizuno
  - et al.
- 2011
- ECTC 2011
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- - Katsuyuki Sakuma
  - Kazushige Toriyama
  - et al.
- 2011
- ECTC 2011
Vacuum ultraviolet (VUV) surface treatment process for flip chip and 3-D interconnections
- - K. Sakuma
  - N. Nagai
  - et al.
- 2009
- ECTC 2009
Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration
- - Akiko Okada
  - Masatsugu Nimura
  - et al.
- 2012
- LTB-3D 2012
Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
- - Naoko Unami
  - Hirokazu Noma
  - et al.
- 2011
- APM 2011
Hybrid au-adhesive bonding using planar adhesive structure for 3-D LSI
- - Masatsugu Nimura
  - Jun Mizuno
  - et al.
- 2014
- IEEE Transactions on CPMT
Effects of vacuum ultraviolet surface treatment on the bonding interconnections for flip chip and 3-D integration
- - Katsuyuki Sakuma
  - Jun Mizuno
  - et al.
- 2010
- IEEE Transactions on Electronics Packaging Manufacturing
Effects of excimer irradiation treatment on thermocompression Au-Au bonding
- - Naoko Unami
  - Katsuyuki Sakuma
  - et al.
- 2010
- Japanese Journal of Applied Physics
Simplified 20-μm pitch vertical interconnection process for 3D chip stacking
- - Katsuyuki Sakuma
  - Noriyasu Nagai
  - et al.
- 2009
- IEEJ Transactions on Electrical and Electronic Engineering