Electrical characterization of 3D Through-Silicon-Vias
- Fei Liu
- Xiaoxiong Gu
- et al.
- 2010
- ECTC 2010
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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100 results for Steven J. Koester
1D Broken-gap tunnel transistor with MOSFET-like on-currents and sub-60mV/dec subthreshold swing
- Siyuranga O. Koswatta
- Steven J. Koester
- et al.
- 2009
- IEDM 2009
A 300-mm wafer-level three-dimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding
- F. Liu
- R.R. Yu
- et al.
- 2008
- IEDM 2008
Effect of elevated implant temperature on amorphization and activation in as-implanted silicon-on-insulator layers
- Katherine L. Saenger
- Stephen W. Bedell
- et al.
- 2008
- MRS Spring Meeting 2008
Ultra-low leakage silicon-on-insulator technology for 65 nm node and beyond
- Jin Cai
- Amlan Majumdar
- et al.
- 2007
- IEDM 2007
Interconnects in the third dimension: Design challenges for 3D ICs
- Kerry Bernstein
- Paul Andry
- et al.
- 2007
- DAC 2007
Fabrication and Mobility Characteristics of Ultra-thin Strained Si Directly on Insulator (SSDOI) MOSFETs
- K. Rim
- K.K. Chan
- et al.
- 2003
- IEDM 2003
Sub-30 nm P+ abrupt junction formation in strained Si/Si1-xGex MOS device
- K.L. Lee
- J.O. Chu
- et al.
- 2002
- IEDM 2002
Nanophotonic biosensors harnessing van der Waals materials
- Sang-Hyun Oh
- Hatice Altug
- et al.
- 2021
- Nature Communications
Bandgap engineering of two-dimensional semiconductor materials
- A. Chaves
- Javad G. Azadani
- et al.
- 2020
- npj 2D Materials and Applications