Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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87 results for Thomas Brunschwiler

A telemonitoring and hybrid virtual coaching solution “CAir” for patients with chronic obstructive pulmonary disease: Protocol for a randomized controlled trial
- - Christoph Gross
  - Dario Kohlbrenner
  - et al.
- 2020
- JMIR Research Protocols
Controlled 3D nanoparticle deposition by drying of colloidal suspension in designed thin micro-porous architectures
- - Feifei Qin
  - Meng Su
  - et al.
- 2020
- Int. J. Heat Mass Transf.
Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
- - Luca Del Carro
  - Alfred A. Zinn
  - et al.
- 2019
- Journal of Electronic Materials
Tricoupled hybrid lattice Boltzmann model for nonisothermal drying of colloidal suspensions in micropore structures
- - Feifei Qin
  - Ali Mazloomi Moqaddam
  - et al.
- 2019
- Physical Review E
Study of non-isothermal liquid evaporation in synthetic micro-pore structures with hybrid lattice Boltzmann model
- - Feifei Qin
  - Luca Del Carro
  - et al.
- 2019
- Journal of Fluid Mechanics
On the Evaporation of Colloidal Suspensions in Confined Pillar Arrays
- - Jonas Zürcher
  - Brian R. Burg
  - et al.
- 2018
- Transport in Porous Media
Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- - Rahel Straessle
  - Severin Zimmermann
  - et al.
- 2018
- IEEE Transactions on CPMT
Relief printing of micron-sized electrical conductive structures on silicon
- - S. Gerke
  - Jonas Zürcher
  - et al.
- 2017
- Flexible and Printed Electronics
Enhanced percolating thermal underfills achieved by means of nanoparticle bridging necks
- - Jonas Zürcher
  - Xi Chen
  - et al.
- 2016
- IEEE Transactions on CPMT
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- - Thomas Brunschwiler
  - Jonas Zürcher
  - et al.
- 2016
- ASME Journal of Electronic Packaging