Integration of intra chip stack fluidic cooling using thin-layer solder bonding
- Yassir Madhour
- Michael Zervas
- et al.
- 2013
- 3DIC 2013
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152 results for Thomas Brunschwiler
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
- Arvind Sridhar
- Yassir Madhour
- et al.
- 2013
- ICCAD 2013
Enhanced electrical and thermal interconnects by the selfassembly of nanoparticle necks utilizing capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2013
- InterPACK 2013
Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
- Gerd Schlottig
- Florian Schindler-Saefkow
- et al.
- 2013
- EPTC 2013
Roadmap towards ultimately-efficient zeta-scale datacenters
- 2013
- HPCS 2013
Hybrid porous media and fluid domain modeling strategy to optimize a novel staggered fin heat sink design
- Ningkang Li
- Gerd Schlottig
- et al.
- 2013
- THERMINIC 2013
Roadmap towards ultimately-efficient zeta-scale datacenters
- 2013
- DATE 2013
Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2012
- IMAPS 2012
Centrifugal formulation of percolating thermal underfills for flip-chip applications
- Jonas Zuercher
- Javier V. Goicochea
- et al.
- 2012
- CIPS 2012
Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
- Yassir Madhour
- Thomas Brunschwiler
- et al.
- 2012
- ICEPT 2012