Publications

155 results for Thomas Brunschwiler

Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- - Thomas Brunschwiler
  - Jonas Zürcher
  - et al.
- 2016
- ITherm 2016
Study of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part A
- - Arvind Sridhar
  - Ozgur Ozsun
  - et al.
- 2016
- ITherm 2016
Study of two-phase pressure drop and heat transfer in a micro-scale pin fin cavity: Part B
- - Pritish R. Parida
  - Arvind Sridhar
  - et al.
- 2016
- ITherm 2016
Stress investigations in 3D-integrated silicon microstructures
- - M. Stiebing
  - Emanuel Lörtscher
  - et al.
- 2016
- EuroSimE 2016
Re-building the Underfill: Performance of percolating fillers at package scale
- - Uwe Zschenderlein
  - Mario Baum
  - et al.
- 2016
- EuroSimE 2016
Master curve synthesis by effective viscoelastic plastic material modeling
- - Florian Schindler-Saefkow
  - Remi Pantou
  - et al.
- 2016
- EuroSimE 2016
Lid-integral cold-plate topology: Integration, performance, and reliability
- - Gerd Schlottig
  - Marco De Fazio
  - et al.
- 2016
- ASME Journal of Electronic Packaging
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- - Thomas Brunschwiler
  - Arvind Sridhar
  - et al.
- 2016
- ASME Journal of Electronic Packaging
Quantifying the thermal conductivity enhancement of percolating thermal underfills
- - Brian R. Burg
  - Jonas Zürcher
  - et al.
- 2015
- EMPC 2015
Steady-state low thermal resistance characterization apparatus: The bulk thermal tester
- - Brian R. Burg
  - Manuel Kolly
  - et al.
- 2015
- Review of Scientific Instruments