Novel hierarchical radially expanding micro-channel networks with pin fins have been proposed recently to enable high-performance two-phase embedded liquid cooling of 2D and 3D integrated circuits. The effective design of such a complex two-phase flow network requires a comprehensive understanding of and the ability to model the various constituent sub-components. In this second part of a two-part paper, detailed analysis of STEAM simulation results and errors is presented. Additionally, a reduced physics two-phase flow (RTP) model has been extended for modeling two-phase flow boiling through chip embedded microscale cavities populated with micro pin-fins. Extensive model validation using several experimental data was performed to quantify the accuracy of this model under different operating conditions. A comparative study has also been performed to compare STEAM and RTP model accuracy and computational time relative to full-physics two-phase flow (FT P) model.