Publications

59 results for Katsuyuki Sakuma

Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- - Katsuyuki Sakuma
  - Bucknell Webb
  - et al.
- 2016
- ECTC 2016
3D integration ESD protection design and analysis
- - Souvick Mitra
  - Ephrem Gebreselasie
  - et al.
- 2015
- EOS/ESD 2015
An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates
- - Katsuyuki Sakuma
  - Krishna Tunga
  - et al.
- 2015
- ECTC 2015
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- - Bing Dang
  - Joana Maria
  - et al.
- 2014
- ECTC 2014
Bonding technologies for chip level and wafer level 3D integration
- - Katsuyuki Sakuma
  - Spyridon Skordas
  - et al.
- 2014
- ECTC 2014
Hybrid au-adhesive bonding using planar adhesive structure for 3-D LSI
- - Masatsugu Nimura
  - Jun Mizuno
  - et al.
- 2014
- IEEE Transactions on CPMT
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- - Keiji Matsumoto
  - Soichiro Ibaraki
  - et al.
- 2013
- 3DIC 2013
Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- - Katsuyuki Sakuma
  - Edmund Blackshear
  - et al.
- 2013
- ECTC 2013
Low temperature Au-Au flip chip bonding with VUV/O ₃ treatment for 3D integration
- - Akiko Okada
  - Masatsugu Nimura
  - et al.
- 2012
- LTB-3D 2012
Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
- - Naoko Unami
  - Hirokazu Noma
  - et al.
- 2011
- APM 2011