Novel ellipsometry-based machine learning technique for characterization of low sensitivity critical dimensions within gate-all-around transistors
- Houssam Chouaib
- Valeria Dimastrodonato
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
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15 results for Daniel Schmidt
Spectral Interferometry for TSV Metrology in Chiplet Technology
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
From Lab to Fab - In-line SIMS for Process Control in Nanosheet Gate-All-Around Device Manufacturing
- Stefan Schoeche
- Katherine Sieg
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Large Feature Wafer Level In-Line Optical Metrology Techniques for Advanced Packaging Schemes
- Katherine Sieg
- Chris Bottoms
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Hardware Based Performance Assessment of Vertical-Transport Nanosheet Technology
- Gen Tsutsui
- Seunghyun Song
- et al.
- 2022
- IEDM 2022
Deep Learning Assisted Hybrid Metrology of Nanosheet Transistors for Fast Film Characterization
- Tao Cai
- Yifei Li
- et al.
- 2024
- MRS Fall Meeting 2024
High-NA EUV Exposure Tool Implications to Chip and Mask Layouts
- Daniel Schmidt
- 2023
- VLSI Technology 2023
Scatterometry-informed machine learning study to determine bi-directional intercorrelation of adjacent patterning steps
- Padraig Timoney
- Stefan Schoeche
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Metrology-Design Co-Optimization for BEOL dimensional characterization using scatterometry
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Scatterometry based methodologies for characterization of MRAM technology
- Manasa Medikonda
- Daniel Schmidt
- et al.
- 2022
- SPIE Advanced Lithography 2022