Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
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62 results for Nick Lanzillo
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Applications of Topological Semimetals for Post-Cu Interconnects
- Ching-Tzu Chen
- Hsin Lin
- et al.
- 2024
- MRS Spring Meeting 2024
Next-Generation Logic Design Architecture for Vertical-Transport Nanosheets
- Biswanath (Biswa) Senapati
- Jeongho Do
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Exploring Topological Semimetals for Highly Scaled Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- MRS Spring Meeting 2023
Unconventional Resistivity Scaling in Topological Semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- MRS Spring Meeting 2023
Unconventional resistivity scaling in topological semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- APS March Meeting 2023
Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- APS March Meeting 2023
Evaluating the Potential of Weyl Semimetals as Future Interconnect Metals
- Sushant Kumar
- Yi-Hsin Tu
- et al.
- 2022
- MRS Spring Meeting 2022
Surface-dominated conductance scaling in Weyl semimetal NbAs
- Sushant Kumar
- Yi-Hsin Tu
- et al.
- 2024
- npj Computational Materials