Applications of Topological Semimetals for Post-Cu Interconnects
- Ching-Tzu Chen
- Hsin Lin
- et al.
- 2024
- MRS Spring Meeting 2024
Publications
64 results for Nick Lanzillo
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- K. Motoyama
- D. Metzler
- et al.
- 2023
- IITC/MAM 2023
Exploring Topological Semimetals for Highly Scaled Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- MRS Spring Meeting 2023
Unconventional Resistivity Scaling in Topological Semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- MRS Spring Meeting 2023
Thermal and Electrical Conductivity of Copper-Graphene Heterosystem: An Effect of Strain and Thickness
- Aiswarya Samal
- Anoop Kumar Kushwaha
- et al.
- 2023
- Advanced Engineering Materials
A Multiscale Simulation Study of the Structural Integrity of Damascene Interconnects in Advanced Technology Nodes
- Sagarika Mukesh
- Nicholas A. Lanzillo
- 2023
- IEEE T-ED
Unconventional resistivity scaling in topological semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- APS March Meeting 2023
Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- APS March Meeting 2023
Methodology Development to Benchmark Power Delivery Designs in Advanced Technology Nodes
- Nicholas A. Lanzillo
- A. Chu
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Next-Generation Logic Design Architecture for Vertical-Transport Nanosheets
- Biswanath (Biswa) Senapati
- Jeongho Do
- et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023