Silicon layer stacking enabled by wafer bonding
- Chuan Seng Tan
- Kuan-Neng Chen
- et al.
- 2006
- MRS Fall Meeting 2006
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9 results for Rafael Reif
Chemical Vapor Deposition of Epitaxial Silicon from Silane at Low Temperatures: I. Very Low Pressure Deposition
- James H. Comfort
- Rafael Reif
- 2019
- JES
Chemical Vapor Deposition of Epitaxial Silicon from Silane at Low Temperatures: II. Plasma Enhanced Deposition
- James H. Comfort
- Rafael Reif
- 2019
- JES
Investigation and effects of wafer bow in 3D integration bonding schemes
- K.N. Chen
- Y. Zhu
- et al.
- 2010
- Journal of Electronic Materials
Bonding parameters of blanket copper wafer bonding
- K.N. Chen
- A. Fan
- et al.
- 2006
- Journal of Electronic Materials
Investigations of strength of copper-bonded wafers with several quantitative and qualitative tests
- K.N. Chen
- S.M. Chang
- et al.
- 2006
- Journal of Electronic Materials
The effect of forming gas anneal on the oxygen content in bonded copper layer
- C.S. Tan
- K.N. Chen
- et al.
- 2005
- Journal of Electronic Materials
Characterization of iodoheptafluoropropane as a dielectric etchant. I. Process performance evaluation
- Simon Karecki
- Ritwik Chatterjee
- et al.
- 2001
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Si/Si1-xGexValence Band Discontinuity Measurements Using a Semiconductor-Insulator-Semiconductor (SIS) Heterostructure
- Brian R. Bennett
- Emmanuel F. Crabbé
- et al.
- 1994
- IEEE Transactions on Electron Devices