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Publication
Journal of Electronic Materials
Paper
Investigation and effects of wafer bow in 3D integration bonding schemes
Abstract
This paper investigates and reviews the effects of wafer bow in three- dimensional (3D) integration bonding schemes, including copper wafer bonding and oxide fusion wafer bonding with silicon on insulator (SOI)-based layer transfer technology. Wafer bow criteria for good bonding quality and fabrication techniques to minimize wafer bow are introduced for 3D integration technology and applications. © 2010 TMS.