Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects
- C.-K. Hu
- D. Canaperi
- et al.
- 2004
- IRPS 2004
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83 results for Donald Canaperi
High-performance SiGe MODFET technology
- S.J. Koester
- J.O. Chu
- et al.
- 2004
- MRS Proceedings 2004
A study of electromigration lifetime for Cu interconnects coated with CoWP, Ta/TaN, or SiC xN yH z
- C.-K. Hu
- D. Canaperi
- et al.
- 2003
- AMC 2003
Carrier mobility enhancement in strained Si-On-Insulator fabricated by wafer bonding
- L.J. Huang
- J.O. Chu
- et al.
- 2001
- VLSI Technology 2001
Post Tungsten CMP Cleaning: Optimization for Cleaning Efficiency and Corrosion Reduction
- Wei-Tsu Tseng
- Pinlei Chu
- et al.
- 2024
- ECS J. Solid State Sci. Technol.
Molecular Interactions in Copper Chemical Mechanical Planarization: A Phenomenological Study
- Mahadevaiyer Krishnan
- Donald F. Canaperi
- et al.
- 2024
- ECS J. Solid State Sci. Technol.
CMP development for Ru liner structures beyond 14nm
- Raghuveer Patlolla
- Koichi Motoyama
- et al.
- 2018
- ECS J. Solid State Sci. Technol.
Extreme-low k porous pSiCOH dielectrics prepared by PECVD
- H. You
- Petra Mennell
- et al.
- 2018
- JVSTB
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- Son Van Nguyen
- Shobha Hosadugra
- et al.
- 2017
- ECS J. Solid State Sci. Technol.
Impact of surface preparation for n-type Si:P and p-type SiGe:B semiconductors on low resistance silicide contacts
- A. Carr
- B. Peethala
- et al.
- 2017
- Microelectronic Engineering