Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
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17 results for Fee Li Lie
Fully on-chip MAC at 14nm enabled by accurate row-wise programming of PCM-based weights and parallel vector-transport in duration-format
- P. Narayanan
- S. Ambrogio
- et al.
- 2021
- VLSI 2021
External Resistance Reduction by Nanosecond Laser Anneal in Si/SiGe CMOS Technology
- Oleg Gluschenkov
- Heng Wu
- et al.
- 2018
- IEDM 2018
Parasitic Resistance Reduction Strategies for Advanced CMOS FinFETs beyond 7nm
- Heng Wu
- Oleg Gluschenkov
- et al.
- 2018
- IEDM 2018
Integrated dual SPE processes with low contact resistivity for future CMOS technologies
- Heng Wu
- Soon-Cheon Seo
- et al.
- 2017
- IEDM 2017
Technology viable DC performance elements for Si/SiGe channel CMOS FinFTT
- G. Tsutsui
- Ruqiang Bao
- et al.
- 2016
- IEDM 2016
A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
- Ruilong Xie
- Pietro Montanini
- et al.
- 2016
- IEDM 2016
HERMES-Core-A 1.59-TOPS/mm2PCM on 14-nm CMOS In-Memory Compute Core Using 300-ps/LSB Linearized CCO-Based ADCs
- Riduan Khaddam-Aljameh
- Milos Stanisavljevic
- et al.
- 2022
- IEEE JSSC
HERMES Core - A 14nm CMOS and PCM-based In-Memory Compute Core using an array of 300ps/LSB Linearized CCO-based ADCs and local digital processing
- Riduan Khaddam-Aljameh
- Milos Stanisavljevic
- et al.
- 2021
- VLSI Circuits 2021
HERMES Core - A 14nm CMOS and PCM-based In-Memory Compute Core using an array of 300ps/LSB Linearized CCO-based ADCs and local digital processing
- R. Khaddam-Aljameh
- M. Stanisavljevic
- et al.
- 2021
- VLSI Technology 2021