Substrate coupling noise issues in silicon technology

Abstract

The importance of substrate crosstalk in real applications and the design guidelines for reducing crosstalk are discussed. The usage of technology features for the reduction of coupling is analyzed with respect to accurate substrate modeling and simulation tools. Two approaches were demonstrated that reduce coupling by locally increasing the resistance by a very large factor. It was found that these approaches reduce substrate crosstalk by blocking the signal, thereby sustaining the high frequency signals that couple capacitively through the transmission regions.