About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
Microelectronic Engineering
Paper
Fabrication of high performance 512Kb SRAMs in 0.25 μm CMOS technology using x-ray lithography
Abstract
Fully functional 512Kb static-random access memory (SRAM) devices containing more than 3.6 million transistors have been successfully fabricated in a 0.25 μm complementary metal oxide semiconductor (CMOS) technology using compact storage ring X-ray lithography thus demonstrating the functionality of the X-ray lithography infrastructure. A lithographic performance comparison was made between x-ray lithography and optical (excimer laser) lithography by fabricating SRAM devices using both lithographic techniques. The excellent process latitude and dimension control available for x-ray lithography is reflected in this comparison. A comprehensive discussion of the advantages of x-ray lithography is discussed in this paper. © 1994.