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Reliability challenges for the 10nm node and beyond
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It has been demonstrated that, in those instances where electromigration-induced mass transport is dominated by interfacial diffusion, the adhesion at the interface where mass transport is primarily taking place is related to the electromigration flux. Furthermore, it is shown that the cohesive energy of the interface is directly related to the activation energy for diffusion. © 2005 IEEE.
James Stathis, Miaomiao Wang, et al.
IEDM 2014
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