Characterization of micro-bump C4 interconnects for Si-carrier SOP applications
- S.L. Wright
- R.J. Polastre
- et al.
- 2006
- ECTC 2006
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28 results for J.R. Lloyd
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
- Albert T. Wu
- N. Tamura
- et al.
- 2005
- MRS Spring Meeting 2005
Successful dual damascene integration of extreme low k materials (k < 2.0) using a novel gap fill based integration scheme
- S.V. Nitta
- S. Purushothaman
- et al.
- 2004
- IEDM 2004
The effect of a threshold failure time and bimodal behavior on the electromigration lifetime of copper interconnects
- R. Filippi
- P.-C. Wang
- et al.
- 2009
- IRPS 2009
On the contribution of line-edge roughness to intralevel TDDB lifetime in low-k dielectrics
- J.R. Lloyd
- X.-H. Liu
- et al.
- 2009
- IRPS 2009
Effects of photoinduced carrier injection on time-dependent dielectric breakdown
- J.M. Atkin
- R.B. Laibowitz
- et al.
- 2009
- IRPS 2009
Integration and reliability of CVD Ru Cap for Cu/Low-k development
- C.-C. Yang
- D. Edelstein
- et al.
- 2009
- IITC 2009
Role of Cu in TDDB of low-k dielectrics
- J.R. Lloyd
- S. Ponoth
- et al.
- 2007
- IRPS 2007
A comprehensive study of low-k SiCOH TDDB phenomena and its reliability lifetime model development
- F. Chen
- O. Bravo
- et al.
- 2006
- IRPS 2006
Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films