Publication
LTB-3D 2014
Conference paper
Copper-to-dielectric heterogeneous bonding for 3D integration
Abstract
A novel hybrid bonding process has been developed that achieved a successful copper/SiO2 heterogeneous bonding. © 2014 IEEE.
A novel hybrid bonding process has been developed that achieved a successful copper/SiO2 heterogeneous bonding. © 2014 IEEE.