Three dimensional dynamic random access memory
- Toshiaki Kirihata
- 2014
- LTB-3D 2014
Conference paper
Publications
2 results at LTB-3D 2014
Copper-to-dielectric heterogeneous bonding for 3D integration
- Wei Lin
- Juntao Li
- et al.
- 2014
- LTB-3D 2014
Conference paper