A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
The scheme of controlled collapse reflow chip joining has been investigated again and extended to the package of Josephson device chips. Low temperature ternary eutectic (In/Bi/Sn) alloy is selected as the solder material which melts at 60°terface metallurgy of Pd/Au was used as an interface layer bridging superconducting Nb pads and the solder. Indium stand-offs are used for controlling collapse and providing constant spacing between chips and carrier modules. Mechanical and electrical test vehicles were fabricated and evaluated. © 1982, The Electrochemical Society, Inc. All rights reserved.
A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
Eloisa Bentivegna
Big Data 2022
J.C. Marinace
JES