Abstract
The scheme of controlled collapse reflow chip joining has been investigated again and extended to the package of Josephson device chips. Low temperature ternary eutectic (In/Bi/Sn) alloy is selected as the solder material which melts at 60°terface metallurgy of Pd/Au was used as an interface layer bridging superconducting Nb pads and the solder. Indium stand-offs are used for controlling collapse and providing constant spacing between chips and carrier modules. Mechanical and electrical test vehicles were fabricated and evaluated. © 1982, The Electrochemical Society, Inc. All rights reserved.